However, the excess heat travels through the multi-layer circuit board's copper traces and spreads over a large area. Although that sounds bad, it's not out of spec for the built-in MOSFETs, which are rated at up to 302☏ (150☌). Our stress test gets them up to 246☏ (119☌). Even on an open test bench, temperatures during our gaming loop reach 234☏ (112☌). Since the PCB was designed to facilitate doubling, one of the two MOSFETS could have been moved into the second regulator circuit's vacant space.Īs our infrared readings demonstrate, though, a lack of active cooling on the VRMs has negative consequences. This is made worse by the fact that two of these MOSFETS are positioned fairly close to each other. But concentrating all of the components in one package also comes with a significant disadvantage: the creation of thermal hot-spots. The three GPU phases are controlled using one uPI Semiconductor uP9505P, with each regulator circuit realized as a highly integrated E6930 Dual N-Channel MOSFET, which combines the gate driver, high- and low-side MOSFET, and Schottky-diode in one convenient package.Īgain, this is meant to cut costs and conserve space. However, this minimalist configuration with just one regulator circuit per phase, similar to Nvidia's reference design, seems to be more popular given its lower cost. In theory, the PCB could have enabled three phases and a maximum of six regulator circuits via doubling for the GPU, plus one phase for the memory.
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